Since our requirements for mobile phones have become higher and higher, although the performance of devices has become more and more powerful, it has also brought about greater fevers. It seems that users are not very comfortable when using mobile phones. After all, Nor do you want to hold a "hot potato" in your hand. Therefore, in order to solve these problems, manufacturers have also spent a lot of thought, introduced a variety of cooling methods to solve the "fever" of this problem.
Graphite heatsink applied to mobile phones
From the birth of the millet mobile phone, it was born as a model of high distribution and low price. In order to solve the heat dissipation problem for the first time, it brought consumers the concept of heat dissipation technology. Xiaomi used the technology of “graphite cooling†as a selling point for mobile phone promotion. , It also opened the first mobile phone cooling technology, followed by many manufacturers have added a variety of cooling technology for their own mobile phone as a product selling point.
Thermal grease on the phone
Thermal grease
Thermal pad
Thermal grease this thing may appear on the phone will feel very high-end atmosphere, in fact, this product is your computer inside the CPU cooling that one! The thermal pad is also a cooling device that can be seen on the computer. The thermal pad is often used to dissipate heat on some graphics memory chips. The thermal pad and the thermal grease are matched together. So now many mobile phones use thermal grease and thermal pad to cool the phone.
In addition to the thermal grease/thermal pad between the chip and the metal shield, OPPO has also introduced a technology called “ice nest coolingâ€. In addition to covering the thermal material directly on the chip, The liquid metal heat sink is added between the chip and the graphite heat spreader. The air layer and the fine gap are not enough to allow the chip to have more area to combine with the heat sink material to improve heat dissipation. effectiveness.
Heat pipe heat dissipation
360 legendary "space water cooling" cooling technology
Heat pipe heat dissipation principle, heat pipe is actually not a copper tube, which contains a large number of capillary-like "wick" can make the heat pipe in the heat liquid temperature changes, so that the working fluid absorbs heat and then moved to a lower temperature area, Expand the heat dissipation area so as to realize heat dissipation for computers and mobile phones.
Heat pipe radiator on computer
Speaking of heat pipe heat dissipation, we must mention the legendary “space water cooling†cooling technology of 360 Curios, which sounds very high? Was not shocked to live, in fact, is still transplanted from the computer technology, CPU heatsink coated with thermal grease and then cover the radiator, CPU and graphics card above the radiator "copper pipe" is the heat pipe.
In fact, the use of heat pipe cooling technology in mobile phones is not only a technology that is currently available, in fact, Sony SONY Xperia Z2 uses a heat pipe as a cooling path, released some time ago, SONY Xperia Z5 Premium also uses two heat pipes to help heat.
One plus mobile phone 2 thermal design
Copper foil heat dissipation is also a commonly used heat dissipation method for commercially available mobile phones. Many of the practical Xiaolong 810's mobile phones use a combination of heat sink grease/thermal pad and copper foil heat sink. The copper foil is often bonded to the middle frame/back cover of the machine to make the metal shield more tightly integrated. In the metal shield, the thermal grease or the thermal pad is used as the heat dissipation method of the SoC. .
Regardless of whether the advanced heat dissipation method or the use of multiple heat dissipation methods are combined with each other, the SoC manufacturers cannot use the better chip architecture and heat control when designing the chip. Controlling heat generation from the source is a better “cooling†method. Hope that this day will come soon!
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