The fool light lamp uses a glass light source carrier (substrate) different from the first generation filament lamp using a copper bracket light source carrier (substrate), the glass carrier (substrate) is formed by a cutting process and the copper bracket carrier (substrate) is by stamping and injection molding. Molding, so we explain the theory and application of glass carrier (substrate) cutting:
1. Based on the basis of Griffith theory
According to the microcrack theory of the fracture of Griffith brittle materials, the fracture of brittle materials can be divided into two processes. One is the generation of microcracks, and the other is the expansion of microcracks. The stress at the end of microcracks is determined by the length of the microcracks (2a) and the radius of curvature of the ends. The specific relationship is as follows:
The formula shows that when an external force is applied to a brittle material (glass is a typical brittle material), the microcrack tip stress will increase exponentially, and as the external force increases, the microcrack length 2a also increases, that is, microcrack propagation. .
2. Based on the application of Griffith theory
When the glass cutter cuts the glass, the cutter wheel with a specific hardness is first used, and its hardness is higher than that of the glass. By applying a certain pressure, speed, and depression amount, the cutter wheel draws a continuous cutting line on the glass surface.
The purpose is to cause certain microcracks on the surface of the glass, and at the same time, the generated microcracks expand in a direction perpendicular to the surface of the glass under the applied pressure (as shown below).
The end of the microcrack is where the stress concentrates. The strain energy stored in the vicinity gradually becomes the fracture surface energy and the microcracks further extend and expand, causing the glass strength to decrease when the linear microcrack propagation occurs on the glass. When a certain degree is reached, the fracture of the material is further accelerated, and the separation and cutting of the glass can be achieved.
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