1. Technical background
LED light source is the focus of the light source market in the 21st century. As a new type of energy-saving and environmentally friendly green light source product, LED is bound to be the trend of future development and is called the fourth generation of new light source revolution. It has the advantages of long life, high light efficiency, high stability, good safety, no mercury, no radiation, and low power consumption. However, the lack of high-efficiency and low-cost integrated light source industry technology is currently the bottleneck restricting the rapid development of white LED indoor general lighting at home and abroad, and is a common key problem to be solved urgently.
This packaging technology "COMMB-LED high light efficiency integrated surface light source" is a very unique and innovative form of technology in the LED industry, with independent and independent intellectual property rights, patent cluster protection formed by many patents and software copyrights, and its extremely high cost performance characteristics Will gradually become the mainstream packaging technology for the entire LED indoor lighting source.
The Chinese meaning of COMMB-LED light source technology is interpreted as the high-efficiency integrated surface light source technology where the LED chip is directly attached to the mirror metal substrate with high reflectance. This technology excludes the concept of brackets, without electroplating, no reflow soldering, and no patching process, so The process is reduced by nearly one third, and the cost is also saved by one third.
Second, the domestic LED industry technology level
At present, LED packaging forms are diverse. However, the overall use of semiconductor packaging technology to adapt to different applications, different dimensions, heat dissipation solutions and luminous effects, the packaging form is also different. LEDs are classified according to package types mainly including Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED, COB LED, etc.
In general, COB LED packaging technology is currently the mainstream technical solution of the LED general lighting industry in domestic and foreign industries, and the LED general lighting industry in the world is striving to find a cost-effective production solution.
However, no matter what kind of LED, the above packaging form needs to design a reasonable packaging form for different application occasions and lamp types, because only the cost-effectiveness and the comprehensive performance of the light source can be used as a terminal light source product, and good practical applications can be obtained. Different from the above types of packaging, the high-light-efficiency and low-power integrated packaging indoor lighting source created by our company's 39 patent groups adopts the vertical integrated packaging technology of chips and lamps, which is self-contained and widely used in indoor lighting such as LED lamps. Tubes, LED bulbs, downlights, etc. It has a high degree of integration, greatly reduces the packaging process and lamp assembly process, improves the degree of automation and operating efficiency, reduces costs, and improves the reliability of product quality. Not only is the product environmentally friendly, but the production process is also clean, with low noise and no pollution.
3. Development trend of LED package light efficiency
As can be seen from the above figure: In 2011, the single LED light efficiency has reached the packaging level of 150Lm / W, and it is expected to reach the level of 200Lm / W by 2013. It will be 3 times that of the current fluorescent energy-saving lamps! Therefore, high light efficiency The functional dysfunction has been eliminated, and cost reduction has become the main obstacle to popularization.
Fourth, the principle of COMMB-LED technology
This "High-efficiency COMMB-LED surface light source integrated packaging technology" is a new technology formed after deep digging of COB LED packaging technology. It adopts imported high-reflectivity aluminum mirror substrate as a direct carrier of LED chips, and adopts independent and innovative insulated injection molding electrodes. The structure, the whole industry chain innovation of the LED solid crystal, bonding wire, and dispensing packaging process process, the use of self-developed intelligent special machines to form the core software and hardware patent technology, fully improve the chip excitation efficiency, reduce the loss of light and thermal resistance, Excluding the complicated bowl injection molding and PCB, SMT, reflow soldering and other processes, it meets the high efficiency integration requirements of the current LED industry, and creatively solves the industrial bottleneck of indoor general lighting with high quality, long life and low cost.
5. The technical level reached by COMMB-LED
"High-efficiency COMMB-LED surface light source integrated packaging technology" is a new type of COB-LED packaging light source technology developed on the basis of the existing COB-LED packaging process based on bold innovation. The technology fully integrates the high light efficiency of indoor general lighting. No glare. No flicker. The use characteristics of the high indicator, from the chip to the package to the entire system of the lamp, the entire industry chain for vertical integration of technology; greatly reduce and optimize the process, Improve the efficiency of integrated packaging, reduce the cost, improve the reliability, reduce the one-time investment cost of equipment, make China break through the foreign patented packaging in the field of white LED packaging COB-LED technology and enter the world's advanced ranks, forming a unique China. COMMB-LED integrated surface light source technology.
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