[Text / "High-tech LED - Technology and Applications" September issue Long Zonghui]
The new LED package form, which has been mentioned at present, includes COB and its improved forms MCOB, MLCOB, COF, and flip chip packages that require flip chip bonding. Is the traditional packaging form really time for this change? Why is there no large-scale promotion of the new packaging form? Which kind of package will be the last "Swordsman"?
Package form
According to the reporter's understanding, there are already three modified forms of MCOB, MLCOB and COF in the market for COB packaging. Simply put, COB encapsulates the LED chip into the whole substrate. Because the coating of the encapsulant and the phosphor is distributed in a plane, the phosphor of the edge is difficult to be excited, which causes the use of the phosphor invisibly. A lot of waste. It is understood that the current COB light efficiency can only be achieved 80-100lm / w, the lower light efficiency seriously restricts the popularity of COB packaging forms, MCOB, MLCOB, COF and other improved forms came into being.
MCOB technology encapsulates LED chips into optical cups, applies phosphors on each single chip and completes processes such as dispensing. With this method, the amount of phosphors used will be greatly reduced, and the efficacy will be improved. The light efficiency of each manufacturer can generally reach 100-120lm/w, but some companies such as Fujian Wanbang have realized the mass production of 175lm/w high-efficiency LED white light products on the basis of this technology.
The MLCOB technology directly encapsulates the LED chip into the optical cup, and at the same time, the prism is added to avoid the loss of light effect caused by the total reflection of the light.
According to Gong Wen, chief engineer of Shenzhen Jingtai Optoelectronics Co., Ltd., the MLCOB light efficiency they developed can exceed 160lm/w, and the 150ML/w MLCOB has been shipped in batches. In order to increase production capacity, Ruifeng has also improved its COB technology and developed a new generation of COF package. In this package form, the commonly used ceramic substrate and aluminum substrate are made into a bracket-like combination and a contiguous structure. “We have been insisting on the use of copper-plated silver substrate materials to improve production capacity and reliability and reduce costs while ensuring product performance,†said Xiong Jianfeng, director of Ruifeng Optoelectronics Lighting Products Center.
Packaging technology needs to be upgraded
From the current point of view, LED still can not solve the core problem of photoelectric conversion efficiency perfectly. If the conversion efficiency of light is higher, the energy waste in heat can be basically ignored. In addition to adding heat sink components, the package is the core part of solving the heat dissipation problem.
"Currently, COB still has various technical problems such as heat dissipation, chip consistency, phosphor ratio, etc. It is still applicable to the field of low-power packaging devices such as indoor lighting, and needs to use high-power packaging devices, such as Regarding the lighting of tunnel lights, COB is still unable to replace the existing packaging form." Tang Guoqing, senior consultant of Career Hong Kong Ltd. said.
"In various package types, flip chip package is most closely related to LED chip factory, because only LED chip factory provides flip chip, packaging companies can complete flip chip packaging." Gong Wen said that flip chip package is flip-chip form, directly Flip the PNPAD onto a ceramic or aluminum substrate. Because it directly contacts the substrate, it is more conducive to heat conduction. However, if the flip chip and the bracket are customized, if the mass production cannot be achieved, solving the cost is a big problem.
Unfinished
For more information, please refer to the September issue of "High-tech LED-Technology and Applications"
The new LED package form, which has been mentioned at present, includes COB and its improved forms MCOB, MLCOB, COF, and flip chip packages that require flip chip bonding. Is the traditional packaging form really time for this change? Why is there no large-scale promotion of the new packaging form? Which kind of package will be the last "Swordsman"?
Package form
According to the reporter's understanding, there are already three modified forms of MCOB, MLCOB and COF in the market for COB packaging. Simply put, COB encapsulates the LED chip into the whole substrate. Because the coating of the encapsulant and the phosphor is distributed in a plane, the phosphor of the edge is difficult to be excited, which causes the use of the phosphor invisibly. A lot of waste. It is understood that the current COB light efficiency can only be achieved 80-100lm / w, the lower light efficiency seriously restricts the popularity of COB packaging forms, MCOB, MLCOB, COF and other improved forms came into being.
MCOB technology encapsulates LED chips into optical cups, applies phosphors on each single chip and completes processes such as dispensing. With this method, the amount of phosphors used will be greatly reduced, and the efficacy will be improved. The light efficiency of each manufacturer can generally reach 100-120lm/w, but some companies such as Fujian Wanbang have realized the mass production of 175lm/w high-efficiency LED white light products on the basis of this technology.
The MLCOB technology directly encapsulates the LED chip into the optical cup, and at the same time, the prism is added to avoid the loss of light effect caused by the total reflection of the light.
According to Gong Wen, chief engineer of Shenzhen Jingtai Optoelectronics Co., Ltd., the MLCOB light efficiency they developed can exceed 160lm/w, and the 150ML/w MLCOB has been shipped in batches. In order to increase production capacity, Ruifeng has also improved its COB technology and developed a new generation of COF package. In this package form, the commonly used ceramic substrate and aluminum substrate are made into a bracket-like combination and a contiguous structure. “We have been insisting on the use of copper-plated silver substrate materials to improve production capacity and reliability and reduce costs while ensuring product performance,†said Xiong Jianfeng, director of Ruifeng Optoelectronics Lighting Products Center.
Packaging technology needs to be upgraded
From the current point of view, LED still can not solve the core problem of photoelectric conversion efficiency perfectly. If the conversion efficiency of light is higher, the energy waste in heat can be basically ignored. In addition to adding heat sink components, the package is the core part of solving the heat dissipation problem.
"Currently, COB still has various technical problems such as heat dissipation, chip consistency, phosphor ratio, etc. It is still applicable to the field of low-power packaging devices such as indoor lighting, and needs to use high-power packaging devices, such as Regarding the lighting of tunnel lights, COB is still unable to replace the existing packaging form." Tang Guoqing, senior consultant of Career Hong Kong Ltd. said.
"In various package types, flip chip package is most closely related to LED chip factory, because only LED chip factory provides flip chip, packaging companies can complete flip chip packaging." Gong Wen said that flip chip package is flip-chip form, directly Flip the PNPAD onto a ceramic or aluminum substrate. Because it directly contacts the substrate, it is more conducive to heat conduction. However, if the flip chip and the bracket are customized, if the mass production cannot be achieved, solving the cost is a big problem.
Unfinished
For more information, please refer to the September issue of "High-tech LED-Technology and Applications"
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