LEDs are available in both discrete and integrated forms. Discrete LED devices have long been packaged and widely used across various industries. After over 40 years of development, a variety of mainstream product types have emerged. Traditionally, LED production equipment manufacturers have followed the process of: LED discrete components → MCPCB light source modules → LED lighting fixtures. This approach is often time-consuming and expensive, as there are no ready-made core light source components to simplify the process.
In comparison, COB (Chip on Board) light source modules can significantly reduce costs associated with primary packaging, light engine manufacturing, and secondary optical distribution. In lighting systems with similar functions, actual measurements show that the cost of the light source can be reduced by about 30%, which is highly beneficial for the application and promotion of semiconductor lighting. Through reasonable design and micro-lens molding, COB modules can effectively avoid issues like hot spots and glare that are common in discrete LED arrangements. Additionally, by integrating appropriate red chips, the color rendering of the light can be improved without significantly compromising efficiency or lifespan.
In practical applications, COB light source modules simplify the installation and production processes for lighting fixture manufacturers, reducing overall application costs. From a production standpoint, existing technologies and equipment are well-suited for high-volume, high-yield manufacturing of COB modules.
As the LED lighting market continues to grow, the demand for lighting products is increasing rapidly. LED production equipment manufacturers can gradually develop a series of mainstream COB light source modules tailored to different lighting applications, enabling mass production.
**Advantages and Disadvantages of COB Light Source**
COB (Chip On Board) is an integrated light source where bare chips are adhered to an interconnect substrate using conductive or non-conductive adhesive, followed by wire bonding to establish electrical connections. This type of light source is also known as a COB planar light source.
The COB module is typically covered with thermally conductive epoxy resin (often silver-doped epoxy). The silicon wafer is placed directly onto the substrate and heat-treated to ensure firm adhesion. Wire bonding is then used to create direct electrical connections between the silicon wafer and the substrate. There are two main types of bare chip technology: COB and flip chip. In COB technology, the semiconductor chip is mounted on a printed circuit board, and electrical connections are made via wire bonding. The entire structure is then encapsulated in resin to ensure reliability. Although COB is the simplest form of bare chip packaging, its packaging density is much lower compared to TAB and flip chip technologies.
Generally, COB light sources are mainly used for indoor lighting. They offer a relatively simple assembly process and more uniform illumination, but their heat dissipation is not as effective as that of TOP (Top Mount) solutions. They are suitable for power ranges of 3–50 watts.
The advantage of a COB planar light source is its wide divergence and full light area. However, it consumes more power and requires more complex setup.
**Its main features include:**
1. It can be freely combined to form various LED lamps, making assembly easier. It helps overcome the size and cost issues of traditional surface-mount LEDs.
2. High reliability, no dead lights or dark spots. The precision packaging ensures good heat dissipation, enhancing chip quality and longevity.
3. Even and soft lighting, with no glare, protecting the eyes. It effectively addresses the issue of dazzling high-power LEDs in the market.
4. High color rendering index and high light efficiency, achieving up to 120lm/W with an illumination angle above 120°. It reduces costs by eliminating the need for an additional PCB, and is eco-friendly with no pollution.
5. Minimal light attenuation under normal current, with less than 3% degradation after 1000 hours.
6. Safe and reliable, operating below 50V, fully considering safety certifications.
COB integrated light sources are widely used in LED lighting, downlights, spotlights, and ceiling lights, and have become one of the mainstream options in the LED industry.
**What are the advantages of ceramic planar light sources?**
**The advantages of ceramic planar light sources include:**
1. Ceramic planar light source modules offer high reliability. Both the ceramic and the chip are made from AL₂O₃ alumina materials, which have similar thermal expansion coefficients. This prevents soldering issues due to temperature changes, ensuring stable performance and reducing light decay.
2. The thermal resistance is below 8°C/W. The ceramic substrate is coated with high-temperature sintered silver, allowing efficient heat dissipation directly from the LED chip to the substrate.
3. The light-emitting surface is large, with high luminous efficiency (over 110lm/W), minimal light decay, and less than 2% light loss after 10,000 hours.
4. As an integrated module, it is easy to assemble and can be directly installed without requiring additional design considerations.
5. During operation, the junction temperature of the phosphor and silica gel can be kept below 120°C. The chip operates normally at surface temperatures of 80–90°C.
6. It has a withstand voltage of over 4000V, offering high safety and compatibility with low-current, high-voltage non-isolated power supplies. This meets export safety certifications and improves power efficiency, thereby enhancing the overall light conversion efficiency of the ceramic planar light source.
7. Strong ESD protection is provided, further enhancing its reliability and performance.
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