LEDs are available in both discrete and integrated forms. Discrete LED devices have been traditionally packaged and widely used across various industries. Over the past 40 years, a range of mainstream product configurations has emerged. The conventional production process for traditional LEDs typically follows this path: LED light source (discrete) → MCPCB light source module → LED lighting fixtures. This method is time-consuming and expensive due to the lack of ready-made core components.
In comparison, COB (Chip On Board) light source modules can significantly reduce primary packaging costs, light engine manufacturing costs, and secondary optical distribution expenses in applications. When compared to traditional LED systems with similar functions, actual measurements show that COB can lower the cost of the light source by approximately 30%, which is highly beneficial for the widespread adoption of semiconductor lighting. With reasonable design and micro-lens molding, COB modules can effectively avoid issues like spot lighting and glare often found in discrete LED setups. Additionally, by integrating appropriate red chips, the color rendering of the light source can be greatly improved without significantly compromising efficiency or lifespan.
In practical applications, COB light source modules simplify the installation and manufacturing processes for lighting fixtures, reducing overall application costs. In terms of production, existing technologies and equipment are well-suited for high-volume, high-yield manufacturing of COB modules. As the demand for LED lighting continues to grow, manufacturers can develop a series of COB modules tailored for different lighting applications, enabling mass production.
**Advantages and Disadvantages of COB Light Source**
COB (Chip On Board) refers to a type of integrated light source where bare chips are directly attached to an interconnect substrate using conductive or non-conductive adhesives, followed by wire bonding to establish electrical connections. This technology is also known as a COB planar light source.
The surface of the COB module is typically covered with thermally conductive epoxy resin—often doped with silver particles—to ensure efficient heat dissipation. The silicon wafer is then placed directly on the substrate and heat-treated until it is firmly bonded. Wire bonding is used to create direct electrical connections between the silicon wafer and the substrate. There are two main types of bare chip technology: COB and flip chip. In COB technology, the semiconductor chip is mounted on a printed circuit board, and electrical connections are made via wire bonding. These connections are then encapsulated with resin to ensure reliability. Although COB is one of the simplest methods for bare chip placement, its packaging density is much lower than that of TAB or flip chip technologies.
Generally, COB light sources are primarily used in indoor lighting. Their advantages include a relatively simple assembly process and more uniform light distribution. However, their heat dissipation is not as effective as that of TOP (Top Mount) solutions, limiting their use to power ranges between 3 to 50 watts.
One key advantage of the COB planar light source is its wide luminous divergence and full light area. However, it tends to consume more power and requires more complex setup during installation.
**Main Features of COB Light Sources:**
1. Flexible combination and integration allow for a variety of LED lamp designs, making assembly easier. It overcomes the drawbacks of large size and high cost associated with traditional SMD LEDs.
2. High reliability, no dead lights or dark spots. The precision packaging ensures efficient heat dissipation, maintaining chip quality and extending its lifespan.
3. Even, soft lighting with no glare, making it eye-friendly. It effectively addresses the issue of dazzling high-power LEDs in the market.
4. High color rendering index and high light efficiency, achieving up to 120 lumens per watt with an illumination angle above 120 degrees. It saves costs by eliminating the need for additional PCB boards, and is eco-friendly with no pollution.
5. Minimal light decay under normal current conditions, with less than 3% attenuation after 1,000 hours of operation.
6. Safe and reliable, operating below 50V, fully considering safety certifications for various applications.
Due to these advantages, COB light sources have become widely used in LED lighting, downlights, spotlights, and ceiling lights, and are now considered one of the mainstream options in the LED industry.
**What Are the Advantages of Ceramic Planar Light Sources?**
Ceramic planar light sources offer several key benefits:
1. High reliability: Both the ceramic and the chip are made from AL₂O₃ alumina materials, which have similar thermal expansion coefficients. This prevents soldering issues caused by temperature changes, ensuring stable performance and reducing light decay and dead lights.
2. Low thermal resistance, below 8°C/W. The ceramic substrate is coated with high-temperature sintered silver, allowing direct heat conduction from the LED chip to the ceramic, resulting in fast and efficient heat dissipation.
3. Wide light-emitting surface with high luminous efficiency of over 110 lm/W. Light decay after 10,000 hours is less than 2%.
4. Integrated design makes it easy to assemble and install, eliminating the need for additional process planning.
5. During operation, the junction temperature of the phosphor and silica gel remains below 120°C, while the chip surface stays at 80–90°C, ensuring normal operation.
6. High dielectric strength above 4,000V, offering strong safety and compatibility with low-current, high-voltage non-isolated power supplies. This helps meet international safety certifications and reduces power supply costs, improving overall efficiency.
7. Strong ESD protection, enhancing the durability and performance of the light source.
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