The 2.5D IC has been almost ready for all process solutions including design tools, manufacturing, and packaging and testing. The most important task for this year is how to increase its mass production capacity in order to allow 2.5D ICs to enter mass production in 2014. Semiconductor technology is becoming systematic, and 3D ICs with different stacked chips will become mainstream trends. One of the major technology trends in the global 3D IC market is the multi-chip packaging. This technology is important for improving the enhanced memory applications, because it can enhance the memory and processor communication. The global 3D IC market is also drawing attention because of the increasing demand for multi-chip packaging technology. Multi-chip packaging technology allows more than two types of memory chips to be packaged in the same ball grid array package (BGA) through an integrated and stacked design, which saves nearly 70% of space compared to two thin small package (TSOP) packages.
Cao Shilun, president of SEMI Taiwan and South East Asia, said that 2.5D and 3D IC process solutions have gradually matured, and the biggest challenge facing the industry is how to increase production capacity. The industry predicts that 3D ICs are expected to officially enter volume production in the coming years, but there are still many challenges to be overcome when they formally enter mass production. Information sharing and cross-industry chain dialogues are necessary conditions for the maturity of the 2.5D and 3D IC markets. Through the SiP Global Summit, it is possible to assist Taiwanese companies in reviewing the maturity and integrity of the 2.5D and 3D IC technology markets and grasp the semiconductor industry's opportunities.
Also known as R134a gas. Under normal temperature for the odorless and colorless gas. Boiling point -26.5 ° C, the freezing point -101 ° C 1.202g/cm3 liquid density. Critical temperature 100.6 ° C Critical pressure 40.03 × 105. Low toxicity, and flame resistant, low chemical reactivity and high stability. PCE fluoride can be obtained CFC-113, via isomerization, fluoride and hydrogen obtained; PCE or fluorinated obtained HCFC-123 and then by fluoride and hydrogen obtained; TCE also as the raw material, fluoride in HCFC-133a, and fluoride system in the product. In refrigeration systems, medical and certain spray foam application is CFC-12 is the preferred alternative.
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