According to forecasts, by the year 2020, more than 50 billion devices will be networked in the world. The MCU, a key component of low-power wireless connectivity and networking devices that is a key component of embedded applications, drives the deployment of millions of Internet of Things (IoT) "endpoints". As the variety of electronic devices and appliances has gradually increased wireless control and communication functions, the use of wireless connections has expanded rapidly. However, achieving better and more efficient interworking between devices is not easy.
As we all know, the Internet of Things laboratory in the 1970s can only be a star network based on a mobile terminal such as a mobile phone. The Internet of Things in the 2.0s is now beginning to cross into the object, and everything will be interconnected. Interoperability. This will undoubtedly bring more challenges to the embedded wireless connection design. Mike Ballard, senior manager of Microchip's Appliance Solutions Group and head of the cloud support project team, pointed out that "embedded designers are familiar with local hardware and software design. But for them, the IT part of IoT products is the challenge. Because, Most embedded designers have little or no design experience in TCP/IP stack, TLS security, payload, and encryption."
Mike Ballard, Senior Manager and Head of Cloud Support Project, Microchip's Home Appliance Solutions
Facing the IoT market trends and challenges that many low-power embedded devices can easily connect to. Microchip has a comprehensive approach to wireless connectivity to control. Microchip's MRF family of Wi-Fi modules makes it easy to add Wi-Fi capabilities to 8-bit, 16-bit and 32-bit MCUs with full application layer protocol stack functionality. Microchip's RN Series Wi-Fi modules integrate a protocol stack that supports certain IP service functions, allowing flexible connectivity to any MCU. Microchip's embedded Wi-Fi solution offers designers a wide range of general-purpose 802.11b/g options with the widest range of compatibility, distance and low power consumption of IoT applications.
In order to achieve a good combination and balance between computing/processing power and low power consumption, MCUs must have enough processing power to meet the needs of the application, while turning these resources off when no related resources are needed. According to Mike Ballard, Microchip's PIC® MCU family of ultra-low power (XLP) technology is the perfect choice for applications that require high levels of processing while maintaining the industry's lowest power consumption. Microchip is known to offer more than 190 PIC MCUs with ultra-low power (XLP) technology that can easily fit into embedded Wi-Fi and Bluetooth modules that fully support IoT functionality. XLP technology meets IoT's low power requirements, providing sleep currents as low as 9 nA and operating currents as low as 30 μA/MHz, and low-power peripherals with various low-power modes to maintain battery-powered IoT The node works for a long time.
Security issues in the Internet of Things era cannot be ignored, and more and more embedded engineers add cloud connectivity to their designs. Mike Ballard highlighted that Microchip has been working on cloud solutions for more than five years and is already very familiar with how to connect embedded applications to the cloud. Microchip's professional IoT ecosystem knowledge and extensive network of cloud partners help accelerate the pace of customer IoT products entering the market. He believes that there is no perfect wireless solution for any application. Each program has its advantages and disadvantages. For Microchip's customer base, it is critical to be able to offer a wide range of wireless solutions for IoT products, such as Wi-Fi® (802.11), Bluetooth® Low Energy, 802.15.4, LoRaTM (long range), sub Wireless solutions such as -GHz RF and authentication modules are key to ensuring that customer designs are performing well in specific applications.
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