On April 22nd, the 1st CEO Conference of 2016 G20-LED Lighting Summit was successfully held in Linyi, Shanxi, and the member company, Shanxi Guangyu Lighting, hosted the summit.
In 2015, the expansion of LED packaging manufacturers accelerated, and mergers and acquisitions became the norm in the industry. The competition in the LED packaging market was fierce. In 2015, the price of devices was close.
In 2016, Q1, the price of LED packaged devices increased steadily, and the growth rate of output value accelerated. In 2016, flip-chip COB and CSP were packaged into hot spots in the market.
It is understood that the LED technology roadmap has developed to the CSP stage, which is due to the upgrade and change of the LED package structure to solve the problem of the light receiving angle, reliability, brightness and mechanism strength faced by the traditional LED package.
“Flip-chip and CSP are becoming two hotspots. These two technologies are not parallel packaging technologies, but cross-over and fusion. Flip-flops represent the mounting method of the chip electrodes, and CSP represents the size of the package relative to the chip. "Xiao Guowei, president of Jingke Electronics, mentioned.
"CSP is currently widely used in the field of backlight applications, but there is still no cost performance in the lighting industry. Perhaps we should also thank the lighting factory for the constant compression of the cost. After the packaging factory is forced to go to Liangshan, SMD products suddenly There is a way out between them. With the price of SMD two years ago, CSP may have the advantage of substitution, but at such a low price, it has not seen much significance." Xiao Guowei said.
The member companies agree that the current flip-chip technology has a place in the high-power, CSP is mainly achieved by flip-chip technology, flip-chip CSP will not replace SMD, EMC and other packaging structures in the short term, but the flip-chip CSP will be in the high-power market in the future. There will be certain advantages and scale.
"In terms of investment, this year our key part is in the packaging process, directly cutting into the flip-chip technology. It is expected that there will be a total of eight production lines for flip-chip technology. At present, the first product production line has been put into use, mainly used for products such as export street lamps, and cost control effects. Very good, at least about 20% down, the competitiveness of the product is greatly improved." Zhang Ming, general manager of Xinli Light Source mentioned.
“And, from the aspects of cost control and process manufacturing, traditional packaging companies still have certain scale effects and cost advantages, especially in the alternative light source market in the small and medium power field. The market potential of traditional packaging in the short to medium term is still very high. Obvious." Xiao Guowei said.
Member companies agree that from the current technical level, it is difficult for LED packaging to appear that a certain technology can replace all other technologies. Each technology trend has its own advantages and disadvantages, depending on different applications.
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