Beijing Kangmet Technology Co., Ltd. ("Kangmet") is a leading manufacturer and processor of insulating materials, specializing in high-power LED packaging adhesives, epoxy resin potting compounds, silicone potting materials, PVC, thermosetting adhesives, and silicone thermal adhesives. The company has built a strong reputation in the industry for its innovative solutions and quality products.
At the 2017 High-tech LED Annual Meeting, Ma Jing, Deputy General Manager of Kangmet, delivered a keynote speech titled "LED Packaging Equipment and Materials" hosted by Xinyichang. In her presentation, she shared insights into the current status and future development trends of SMC (Sheet Molding Compound) materials used in high-power LED applications. Her talk provided valuable knowledge to the audience, helping them understand the material properties and their relevance in modern lighting technology.
Currently, materials like PPA, PCT, and EMC are widely used in the market, with their properties largely determined by their chemical structures. Ma Jing began her discussion from a structural perspective, explaining the unique characteristics of each material.
First, she introduced PPA (Polyphthalamide), a polyamide-based material known for its good whiteness and ease of processing due to its relatively low melting point. However, PPA has limited photothermal aging resistance, making it suitable only for low-power applications, typically below 0.5 watts.
Next, she discussed PCT (Poly(1,4-cyclohexylene dimethylene terephthalate)), a polyester-based material that offers better photothermal stability and reliability compared to PPA. While PCT provides improved whiteness, it requires higher processing temperatures and has a narrower molding window, which can make it more challenging to work with. Additionally, its raw material costs are higher than those of PPA, limiting its use to 0.5-1 watt applications.
Then, Ma Jing covered EMC (Epoxy Molding Compound), which uses a molding process to achieve even better photothermal aging performance. EMC materials can reach up to 97% initial whiteness, offering excellent reliability. However, the reliance on imported raw materials increases production costs, and the molding equipment required is expensive. Currently, EMC is mainly used in 0.5-1 watt products.
She also explored the potential of silicone encapsulants for scaffold materials, given their improved heat resistance. According to Ma Jing, silicone resins, primarily composed of silicon oxide, offer excellent compatibility between similar or identical materials, providing significant advantages in terms of reliability.
Although SMC is still in the research and development phase or small-scale production, Kangmet has positioned SMC for use in products rated at 3 watts and above. As the industry moves from 2835 to 3030 packages, and now toward SMC, there is growing interest in whether more cost-effective solutions will emerge.
Ma Jing pointed out that CSP (Chip Scale Package) technology currently comes with high costs due to its compact size, offering benefits like thinness and lightness but facing challenges such as high current density and demanding adhesive requirements. At present, under an 800 mA current, the material reaches its thermal limit, and as photoelectric density increases, cracking becomes more likely. Additionally, yield control and cost management remain significant issues.
To improve cost efficiency, Kangmet is working on making SMC raw materials closer to EMC, aiming for similar performance at a lower cost. The company has also conducted gas barrier tests, comparing SMC and EMC materials. Results showed that SMC offers overall improved airtightness, further enhancing its potential in high-performance LED applications.
As the LED industry continues to evolve, companies like Kangmet are playing a key role in shaping the future of packaging materials, ensuring both performance and cost-effectiveness. With ongoing R&D and innovation, the next generation of materials promises to bring even greater advancements to the field.
â—† UL&ENEC&CQC Safety Approvals
â—† Long life & high reliability
â—† Variety of Levers
â—† Wide Range of wiring Terminals
â—† Wide used in Automotive Electronics,Appliance and Industrial Control etc.
Features
â—† Designed For Water and Dust Tight(IP67)
â—† Small Compact Sizeâ—† UL&ENEC&CQC Safety Approvals
â—† Long life & high reliability
â—† Variety of Levers
â—† Wide Range of wiring Terminals
â—† Wide used in Automotive Electronics,Appliance and Industrial Control etc.
â—† Customized Designs
Dustproof Micro Switch,Micro Switch Company,Long Lever Micro Switch,Micro Selector Switch
Ningbo Jialin Electronics Co.,Ltd , https://www.donghai-switch.com