Beijing Kangmet Technology Co., Ltd. ("Kangmet") is a leading production and processing enterprise specializing in the management of insulating materials. The company primarily focuses on high-power LED packaging adhesives, epoxy resin potting compounds, silicone potting agents, PVC, thermosetting adhesives, and silicone thermal adhesives. These products are widely used in various industrial applications due to their superior performance and reliability.
At the 2017 High-tech LED Annual Meeting, held on December 22nd, Ma Jing, Deputy General Manager of Kangmet, delivered a keynote speech titled "LED Packaging Equipment and Materials" organized by Xinyichang. In her presentation, she discussed the current status and future development trends of SMC (Sheet Molding Compound) materials used in high-power LED scaffold applications. Her insightful talk provided valuable knowledge about SMC materials and their potential in the evolving LED industry.
Currently, PPA, PCT, and EMC materials are commonly used in the market, with their properties largely determined by their chemical structures. Ma Jing began by explaining the structural characteristics of these materials and how they influence performance.
First, PPA (Polyphthalamide) is a polyamide material known for its good whiteness and ease of processing due to its relatively low melting point. However, its photothermal aging resistance is limited, restricting its use to low-power applications below 0.5 watts.
Next, PCT (Poly(cyclohexylene dimethylene terephthalate)) is a polyester-based material that offers better photothermal aging performance compared to PPA, along with improved whiteness and reliability. Despite these advantages, PCT requires higher processing temperatures and has a narrower molding window, making it more challenging to process. Its raw material costs are also higher than those of PPA, and it is typically used for 0.5–1 watt applications.
EMC (Epoxy Molding Compound) is another popular material, known for its excellent photothermal aging performance and high initial whiteness, often reaching up to 97%. While EMC offers superior reliability, it relies heavily on imported raw materials, leading to higher costs. Additionally, the molding process requires specialized equipment, which increases initial investment. EMC is mainly used for 0.5–1 watt LED applications.
Silicone encapsulants have gained attention due to their improved heat resistance. Ma Jing explained that silicone resin, primarily composed of silicon oxide, offers excellent compatibility with other materials, enhancing overall reliability. This makes silicone an attractive option for high-temperature applications in LED packaging.
SMC materials are still in the research or small-scale production phase. According to Ma Jing, Kangmet currently targets SMC for applications above 3 watts, positioning it as a promising alternative for higher power LED systems.
Looking ahead, the evolution from 2835 to 3030 packages and now to SMC suggests a shift toward more advanced and cost-effective solutions. However, current CSP (Chip Scale Package) technology remains expensive due to its compact size, despite offering thin and lightweight benefits. Challenges include high current density, which puts significant demands on packaging adhesives. At 800 mA, the adhesive’s thermal limits are already being reached, and increased photoelectric density can lead to cracking issues. Additionally, yield rates and cost control remain major concerns.
To address these challenges, Kangmet is exploring ways to reduce SMC costs by aligning its raw materials with those of EMC. The company has also conducted gas barrier tests, comparing SMC and EMC materials. Results show that SMC offers improved overall airtightness, making it a viable option for future high-performance LED applications.
With ongoing research and development, Kangmet continues to push the boundaries of material science in the LED industry, aiming to deliver reliable, efficient, and cost-effective solutions for next-generation lighting technologies.
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Description
-Contact Resistance:≤50mΩ
-Insulation Resistance:≥100mΩ
-Dielectric Strength:1,500V,
-1min Electronic Life:10,000 cycles
-Operating temperature:T120
-Rating current/voltage:6A 250V AC
Features
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â—† Micro contact gap,high speed operation,high sensitirity,Micro operatizon travel.
â—† Long life & high reliability
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