At present, domestic chip post-processing equipment is basically imported from the United States, Japan and Taiwan. A small percentage of domestically produced equipment provides better performance. The actual post-processing equipment of the chip is not much less than the MOCVD investment (the sum of the three types of main equipment evaporation machine, PEVCD, wafer cutting machine is about 7 million, the cost is about 50% of the single MOCVD), plus the construction and plant Costs, etc., often exceed the investment in the front-end equipment.
Taking wafer cutting machines as an example, the method of diamond cutting a 2-inch sapphire substrate commonly used before the industry before 2009 depends on the skill level of the operator, so there are problems in quality stability and yield. As the substrate size gradually increases from 2 inches to 4 inches, diamond equipment is not the best choice, and laser dicing can be used for automatic high-speed machining to improve yield. Laser sapphire substrate laser cutting is a key part of the LED manufacturing process. At present, Japan, Switzerland and the United States have almost 80% market share. GLII predicts that the future of laser dicing will undoubtedly provide new business growth points for several traditional laser equipment manufacturers in China. Among them, Suzhou Delong, Dazu Laser and Huagong Laser have already launched wafer laser cutting equipment for LED. GLII predicts that domestic LED chip manufacturers will have an annual demand of more than 1,000 units, and the market size will exceed 2 billion yuan.
Wafer cutting machine manufacturers also benefited from the LED boom in 2009. The global leader, Japan Disco, disclosed that its first quarter 2010 revenue surged 260% compared with the same period in 2009, an increase of 16% from the fourth quarter of 2009. Another Polish manufacturer, ESI, which successfully entered the Taiwan and mainland markets, lost $15 million in the first quarter of 2009, but still maintained a profit of $3 million for the year.
1.Shape:Conical ,Multi-pyramidal,Columniform,polygonal or conical
2.Material:steel plate.stainless steel compound plate,stainless steel plate,ect.(anticorrosion treatment with hot galvanization,also color polyester power could be coated on the surface)
High strength low alloy steel Q235,Q345,GR65,GR50 to ensure the mechanical properity of microelement in order to ensure the quality of galvanization (other materials are also avaliable on request)
3.Jointing of pole with insert mode,innerflange mode,face to face joint mode
4.Design of pole :against earthquake of 8 grade ,aganist wind pressure of 160
5.Minimum yield strength:355 mpa
6.Minimum ultimate tensile strength :490 mpa
7.Max ultimate tensilestrength:620 mpa
8.Certificate:ISO9001-2000
9.Length:Within 14m once forming without slip joint
10.Welding:It has past flaw testing.Internal and external double welding makes the welding beautiful in shape
11:Packages:Our poles as normal cover by Mat or straw bale at the top and bottom ,anyway also can following by client required , each 40HC or OT can loading how many pcs will calculation base on the client actually specification and data
Our lighting equipment are made from quality sheet from bending,forming,automatic welding and hot galvanization.We can reach one-run machining length of 14m,and can bend sheet thickness up to 25mm.We adopt advanced welding procedures ,automatically weld main joints and reach rank-II welding quality.
Galvanized Steel Pole,Galvanized Steel Electric Pole,Monopole Galvanized Steel Electric Pole,Galvanized Steel Street Lighting Poles
YIXING FUTAO METAL COMPONENT UNIT CO.,LTD , http://www.chinasteelpole.com