Although the prospects are uncertain, the 28-nanometer manufacturing process of Taiwan Semiconductor Manufacturing Co. Ltd. and its 28-nanometer manufacturing process are already in line with international semiconductor giants such as Samsung Electronics and Intel. At present, TSMC's 28-nanometer manufacturing capacity The demand is still in short supply. For the complete seller's market, under the action of many overseas wafer suppliers who are still actively planning to improve product performance and reduce costs, the situation that TSMC's 28nm process capacity utilization is nearing full capacity at this stage is expected to continue.
TSMC previously stated in the 3rd quarter of 2011 that compared to the 28-nanometer process, which accounted for approximately 0.5% of the company's 3rd quarter revenue contribution, it is expected that in the fourth quarter, the company will increase its customer's orders and account for the company's The proportion of performance will grow to more than 2%. As for the planning production scale of the 28-nanometer process at the end of 2011, the production capacity will exceed 20,000 in a single month. By the end of 2012, the planned production capacity of 28-nanometer products at the 15 plants in the Taichung Science Park will be a multiple of one breath. Expanded to more than 50,000 pieces of economic scale in a single month, then the 28nm process performance contribution will rise further to more than 10% level.
So far, AMD, Altera, Qualcomm, Xilinx, NVIDIA, and Altera have all been stable customers for TSMC's 28nm process, as well as Broadcom and STMicroelectronics. LSI will soon be included in the scope of TSMC power. According to industry figures, although the global semiconductor industry is negative in 2012, the growth rate of the industry will also be suppressed, but it will win! The family understands that investment must be stepped up at the bottom of the economy to achieve a good harvest when the economy turns favorable. It also believes that the gap between the company and its competitors must be reduced. TSMC’s advanced process technology production capacity is still in the market.
Even many overseas wafer suppliers must reduce the amount of capital expenditures in 2012. They can only put their major R&D funding on TSMC. They have no time to co-operate with others. This also allows TSMC's 28nm process capacity to remain on the seller's market. Without advance booking, no additional capacity may be available in 2012.
In the case of visibility of customer orders for more than 6 months, TSMC's current 28-nanometer manufacturing capacity expansion action is still carried out as expected, even slightly ahead of schedule, and the pace of internal production of 20-nanometer processes has also accelerated.
The overseas equipment makers also pointed out that in the face of negative economic conditions in 2012, many customers have taken action to reduce capital expenditures, and even postpone orders for 2011 shipments, but the most advanced technology below 28nm. With regard to the delivery of equipment, due to the better visibility of orders from first-tier semiconductor companies and sufficient funds, there was a wave of arms race fever, and orders for related equipment were still busy with shipments.
TSMC previously stated in the 3rd quarter of 2011 that compared to the 28-nanometer process, which accounted for approximately 0.5% of the company's 3rd quarter revenue contribution, it is expected that in the fourth quarter, the company will increase its customer's orders and account for the company's The proportion of performance will grow to more than 2%. As for the planning production scale of the 28-nanometer process at the end of 2011, the production capacity will exceed 20,000 in a single month. By the end of 2012, the planned production capacity of 28-nanometer products at the 15 plants in the Taichung Science Park will be a multiple of one breath. Expanded to more than 50,000 pieces of economic scale in a single month, then the 28nm process performance contribution will rise further to more than 10% level.
So far, AMD, Altera, Qualcomm, Xilinx, NVIDIA, and Altera have all been stable customers for TSMC's 28nm process, as well as Broadcom and STMicroelectronics. LSI will soon be included in the scope of TSMC power. According to industry figures, although the global semiconductor industry is negative in 2012, the growth rate of the industry will also be suppressed, but it will win! The family understands that investment must be stepped up at the bottom of the economy to achieve a good harvest when the economy turns favorable. It also believes that the gap between the company and its competitors must be reduced. TSMC’s advanced process technology production capacity is still in the market.
Even many overseas wafer suppliers must reduce the amount of capital expenditures in 2012. They can only put their major R&D funding on TSMC. They have no time to co-operate with others. This also allows TSMC's 28nm process capacity to remain on the seller's market. Without advance booking, no additional capacity may be available in 2012.
In the case of visibility of customer orders for more than 6 months, TSMC's current 28-nanometer manufacturing capacity expansion action is still carried out as expected, even slightly ahead of schedule, and the pace of internal production of 20-nanometer processes has also accelerated.
The overseas equipment makers also pointed out that in the face of negative economic conditions in 2012, many customers have taken action to reduce capital expenditures, and even postpone orders for 2011 shipments, but the most advanced technology below 28nm. With regard to the delivery of equipment, due to the better visibility of orders from first-tier semiconductor companies and sufficient funds, there was a wave of arms race fever, and orders for related equipment were still busy with shipments.
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