"High power and integration is a trend in the development of LED chips and light sources," said Lin Xiaoning, deputy general manager of Jingke Electronics (Guangzhou) Co., Ltd.
He said that the improvement of luminous efficiency and the reduction of device cost are the trends in the development of LED core technology. At present, the increase in epitaxial chip technology has led to a rapid decline in the cost ratio, but the discrete chip back-end process and the traditional packaging process have become cost bottlenecks. In addition, when the LED device efficiency is >150lm/W, it also faces the problem of large-size LED chip, package heat dissipation problem, traditional LED package problem, such as cost and structure, with the higher illumination of LED light source design and multi-function use. Demand for modular light sources and system-function light sources is rapidly increasing. He believes that high power and integration are a trend in the development of LED chips and light sources.
The so-called LED chip / module light source technology and system integration package, that is, the application of VLSI technology, wafer level packaging technology, system package technology and LED chip technology combination, reducing the traditional single LED chip packaging process and cost, to achieve chip-level light source . The integration of the chip light source on the chip shortens the LED industry chain. "Traditional LEDs, from chip to package to circuit board to application, are relatively independent of each link, and the various links of the chip light source are integrated or matched with each other." Lin Xiaoning said, "On the chip light source, the chip is high-power, integrated; package Chip-level integration, no gold wire interconnection, which simplifies packaging, reduces cost, and improves reliability; the circuit is integrated in the substrate and on the substrate, the chip is matched with it; the application is more diverse and personalized , versatile and intelligent."
The development trend of chip module light source is mainly driven by the development of technology in the lighting market: high-brightness LED for market demand; chip light source for secondary light source design; portable product requires more integrated light source; in commercial lighting, road lighting , special lighting, flash, light engine and other fields, integrated LED light source has a large application market.
Compared with the package-level module, the chip-level module is small in size, saves space, saves packaging cost, and has high concentration of light source, which is convenient for secondary optical design.
At present, there are mainly three chip-level modules. One is a positive-loading chip module. The gold wire interconnection seriously affects module reliability, high thermal resistance, and low package yield. The second is the vertical chip module, the bracket needs special production, the gold wire interconnection affects the reliability of the module, and the package yield is low. The third is flip-chip module, which realizes no gold wire module, high reliability, low thermal resistance and high package yield. Jingke Electronics is using the third chip technology.
The chip module based on flip-chip technology can realize the advantages of matching between the parameters of the chip and the integrated memory of the function in the backplane to ensure the reliability. The company's high-power LED chip products with low voltage, high brightness, high reliability, high saturation current density and easy to achieve large size and high power.
Flip-chip high-power high-voltage LED chip modules have achieved breakthroughs in technology and design. Through the flip-chip soldering design, the interconnection between the various units inside the HV-LED is realized by the wiring on the Si substrate, which breaks through the problem of interconnecting the deep slope between the isolation units in the dressing process; the chip-level module design realizes the super power Matching the target market demand, breaking through the problem that the single chip power does not match the target market; through the internal gold-free line flip-chip module design, it breaks through the process yield of the chip-level module due to the gold wire. Reliability risk issues.
Lin Xiaoning believes that flip-chip high-power LED chip modules will have a profound impact on market development and competition. The flip-chip chip module light source has unique technical advantages in the integrated light source, and will gain an important market position in the field of integrated light source; the flip-chip high power high voltage LED chip module meets the development needs of the indoor lighting market, and from the industry The chain-fitting angle reduces system cost and will gain an increasingly important market position in this segment; the technology will further integrate rectifier bridges, control and drive and Si pedestals in the future, in line with future indoor lighting sources for AC- LED, dimming, intelligent control needs.
"Flip-chip super high-power high-voltage LED chip module combines the advantages of various technologies, which is suitable for indoor lighting integration, ultra-high power, limited installation space, high efficiency. This technology is an example of chip light source technology, its technology The core is the combination of high-power flip-chip technology and large-scale integrated circuit technology, which will further develop towards AC-LED module, dimming and intelligent light, with systematic and complete technical advantages and development routes." Lin Xiaoning concluded .
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